SolidRun Unveils New i.MX 8M Plus Portfolio of Embedded Modules and Carrier Options

 SolidRun Unveils New i.MX 8M Plus Portfolio of Embedded Modules and Carrier Options

SolidRun’s i.MX 8M Plus Micro Computer Solutions are Ideal for Developing Powerful and Efficient Edge Computing Applications that Benefit from Image Signal Processing and Neural Net Acceleration

 SolidRun, a leading developer and manufacturer of high-performance edge computing solutions, today announced a new line of embedded Computer on Module (CoM) solutions based on NXP’s powerful new i.MX 8M Plus applications processor, and three feature-rich, market-ready carrier solutions for quick prototyping and expedited time-to-market for new products.

To help developers quickly design and prototype new machine learning applications for the edge, SolidRun created two CoM options that build upon NXP’s recently released i.MX 8M Plus applications processor. Offered in quad- and dual-core configurations, the new CoMs maintain the same ultra-compact 47mm by 30mm footprint and pin layout as SolidRun’s other i.MX 8M CoM products, making it easy for developers to scale up or down between SolidRun’s i.MX8M product families, including the i.MX8M / i.MX8M Mini/ i.MX8M Nano. Pin compatibility and shared software resources provide a flexible and forward-thinking approach to creating future-proof products for high-performance and low power applications. While compact, SolidRun’s i.MX 8M Plus CoMs maintain all of the necessary subsystems and connectivity options needed for consumer and industrial grade IoT and small edge applications. They are also well suited for a range of environments and can be used in applications requiring passively cooled devices.

From simple applications to those that require high-performance processing capabilities for AI and machine learning inference at the edge, SolidRun’s i.MX 8M Plus CoMs feature dual- or quad-core ARM® Cortex® A53 processors running at up to 1.8 GHz, and an integrated Cortex® M7 core that provides real-time performance and enables low power operating modes. Both CoMs feature a high-performance Cadence® Tensilica® HiFi 4 DSP that supports voice and natural language processing chores – great for building voice-enabled solutions. Additionally, the new CoMs feature an integrated neural processing unit for enhanced AI and machine learning capabilities at the edge. 

“Our cost-effective, feature-rich family of i.MX 8M CoMs have been instrumental in supporting developers with turning ideas into actual, working IoT products,” said Dr. Atai Ziv, CEO at SolidRun. “The addition of our new i.MX 8M Plus CoMs will unlock a near limitless world of possibilities, allowing customers to take advantage of the i.MX 8M Plus’s numerous embedded features to create exciting new IoT solutions that benefit from real-time machine learning inference and computer vision at the edge.” 

SolidRun also unveiled three HummingBoard carriers specifically designed to maximize the vast features and benefits embedded into its i.MX 8M Plus-based CoMs – the HummingBoard Mate, HummingBoard Pulse and HummingBoard Ripple. These new market-ready carrier boards enable manufacturers to pair the features of SolidRun’s i.MX 8M Plus CoMs with USB 3.0, gigabit ethernet, mikroBUS™ connectivity, HDMI output, audio input and output, display output, camera input (Basler MIPI CSI-2 cameras), and much more. Combined, SolidRun’s i.MX 8M Plus CoMs and HummingBoard carriers provide product developers the tools needed to quickly prototype and bring to market consumer and industrial edge solutions. In fact, they can be deployed as-is for edge computing and industrial IoT applications. SolidRun even offers branded cases and housing solutions, making SolidRun a one-stop shop for hardware design, development and turn-key, market-ready products.

Please see our i.MX 8M Plus product portfolio introduction video here: https://youtu.be/MISeM3alPNc

The i.MX 8M CoMs start at a promotional price of $75, while kits containing a HummingBoard carrier and an i.MX 8M CoM start at a promotional price of $135. These prices will remain in effect until March 2021. Customers can order these products today at www.solid-run.com.  

For more information about the i.MX 8M Plus CoMs, please visit https://www.solid-run.com/nxp-i-mx8m-family/imx8m-plus-com/

Specifications for SolidRun’s i.MX 8M Plus Computer on Module solutions include: 

i.MX 8M Plus Quadi.MX 8M Plus Dual
Processor coreQuad core Arm Cortex A53Dual core Arm Cortex A53
Processor speed1.8GHz Commercial1.8GHz Commercial
1.6Ghz Industrial1.6Ghz Industrial
NPU (ML/AI)up to 2.3 TOPsup to 2.3 TOPs
General Purpose ProcessorArm Cortex M7 (up to 800MHz)Arm Cortex M7 (up to 800MHz)
Floating PointVFPv4VFPv4
SIMDNEONNEON
Graphics Processing UnitVivante GC7000ULVivante GC7000UL
GPU SupportOpenGL ES 3.1/3.0OpenGL ES 3.1/3.0
VulkanVulkan
Open CL 1.2 FPOpen CL 1.2 FP
OpenVG 1.1OpenVG 1.1
HW Video Dec/EncHW Video Dec/EncHW Video Dec/Enc
Memory32 bit, up to 8GB LPDDR4-4000 MT/s32 bit, up to 8GB LPDDR4-4000 MT/s
Wired Network2 x 10/100/1000 Mbps2 x 10/100/1000 Mbps
1 x with TSN1 x with TSN
Wireless Network802.11 ac/a/b/g/n (Optional)802.11 ac/a/b/g/n (Optional)
BluetoothBT 5.0 (Optional)BT 5.0 (Optional)
Display Max resolution2x 1080p @ 602x 1080p @ 60
Display InterfacesHDMI 2.0HDMI 2.0
MIPI-DSIMIPI-DSI
LVDSLVDS
Supported External StorageNOR-FlashNOR-Flash
SD/microSDSD/microSD
PCIe SSDPCIe SSD
Supported Internal StorageeMMCeMMC
USB 3.02 Dual role2 Dual role
Serial ports2 (RTS/CTS/RX/TX) +1 (TX/RX)2 (RTS/CTS/RX/TX) +1 (TX/RX)
Digital audio serial interface18x I2S TDM18x I2S TDM
DSD512DSD512
S/PDIF Tx + RxS/PDIF Tx + Rx
8-ch PDM Mic input8-ch PDM Mic input
eARCeARC
ASRCASRC
Low power voice accelerator: Cadence® Tensilica® HiFi 4 DSP @ 800 MHzLow power voice accelerator: Cadence® Tensilica® HiFi 4 DSP @ 800 MHz
Camera interface port1 x MIPI-CSI2 (4 Lane each) on SOM1 x MIPI-CSI2 (4 Lane each) on SOM
1 x on the carrier1 x on the carrier
ISP2 (Resolution up to 12MP and input rate up to 375MPixels/s)2 (Resolution up to 12MP and input rate up to 375MPixels/s)
PCIe Gen 311
I2C22
SPI11
PWM44
GPIO7575
JTAGTest Point HeaderTest Point Header
CAN-FD22
Supported OSLinux / Android Linux / Android 
Main Voltage5V5V
IO Voltage3.3V / 1.8V3.3V / 1.8V
SOM interface3 x Hirose DF40 connectors 1.5mm up to 4.0mm mating height3 x Hirose DF40 connectors 1.5mm up to 4.0mm mating height
SOM Supply3.3V / 1A3.3V / 1A
EnvironmentCommercial: 0°C to 70°CCommercial: 0°C to 70°C
Industrial: -40°C to 85°CIndustrial: -40°C to 85°C
Humidity (non-condensing): 10% – 90%Humidity (non-condensing): 10% – 90%
Dimensions47mm x 30mm47mm x 30mm

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